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We offer high-performance plating equipment that supports cutting-edge plating technology.

We offer various types of wafer plating equipment in accordance with a customer’s needs, from mass-production systems to prototyping or low-volume production. Our comprehensive plating system focuses on compatibility with chemical processes and, with its high performance, is capable of coping with advancing technology such as wafers of increasing diameters and decreasing chip sizes.

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POSFER E
  • Stir-cup equipped with paddle stirring mechanism inside cup
    (Suitable for bumps, vias, rewiring, W-CSP and MEMS)
  • Wafer size : 100-200 mm

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Stir CUP-PLATER/CUP-PLATER
  • Systems available for prototyping to production on a mass scale
  • Semi-automatic type with high practicality and maintainability
  • Wafer Size:100-300 mm

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POSFER C/M
  • Fully automated system for single-and multi-layer plating
  • Designed for easy production scale-up
  • High operability with selectable automatic and manual modes
  • Wafer Size: 100-200 mm

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极速赛车预测

POSFER C-ST
  • Compact and single-frame structure for medium-volume production
  • Our company’s smallest fully automated system
  • Stir-Cupequipped with paddle stirring mechanism inside cup
  • WaferSize:100-200 mm

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RAD-Plater
  • Stir-Cupequipped with paddle stirring mechanism inside cup
  • Can be operated with 10 L of plating solution
  • Easy installation with 100 V power supply and air
  • Via filling property of high aspect is good

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Contact us for further information or materials (24 hours a day)
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