极速赛车官方平台

极速赛车开奖

极速赛车龙虎走势图

极速赛车历史结果

Our bumping wires are available with bump formation methods for increasingly smaller, thinner, and higher-density electronics packaging. Bumps can be formed on semiconductor devices, such as ICs and LSIs, and other microelectronic devices at a lower cost and with fewer irregularities.

极速赛车官方网址

  • Bumps can be formed with a minimum variance in neck height
  • Bumps can be formed with a minimum variance in shape
  • Suitable for small-volume production

极速赛车计划群

极速赛车最新开奖号码

极速赛车一天多少期

  • In the high temperature storage test (200°C), the shear strength after bump formation, decreases less than other bumping wires (GBC)

极速赛车人工全天计划

极速赛车开奖结果计划

极速赛车一天多少期

  • Chips are not damaged during bump formation
Neck Height

Neck Height

Bump Shape

Bump Shape

极速赛车官网开奖结果

Contact us for further information or materials (24 hours a day)
澳洲幸运10公式 秒速飞艇群 秒速飞艇开奖历史记录