We offer cadmium-free silver oxide contact materials for a wide range of applications.
We offer rivet contacts of various materials and shapes to suit every need.
Our Micro Profiles enable the miniaturization of relays and switches at a low cost.
Our contact welding techniques enable welding of all types of contacts with a comprehensive system from prototyping to mass production.
Multi-layer and multi-strip tapes available.
Your choice of width and thickness in long lengths.
Our precious metal spring contacts are available in fine patterns, which contributes to product miniaturization.
Our bumping wire enables the formation of uniform and homogeneous bumps.
We are the world’s largest provider of bonding wires, delivering optimum quality wires suitable for ICs and LSIs.