We support further integration of electronic components and offer reliable quality.
We offer low-cost plating processes that meet the stringent requirements of a variety of applications.
We offer high-performance plating equipment that supports cutting-edge plating technology.
Gold-tin brazing alloys for high reliability sealing / bonding.
Our gold-tin alloys are available in various shapes and sizes.
We offer brazing filler metals of various alloys and shapes to suit your applications.
Our active brazing filler metals enable direct ceramic brazing.
Our sintering technology meets our customer’s expectations
We offer a wide variety of high quality products.
Our bumping wire enables the formation of uniform and homogeneous bumps.
We are the world’s largest provider of bonding wires, delivering optimum quality wires suitable for ICs and LSIs.