极速赛车最快开奖

极速赛车官方开奖

极速赛车开奖官方

极速赛车app下载

Our bumping wires are available with bump formation methods for increasingly smaller, thinner, and higher-density electronics packaging. Bumps can be formed on semiconductor devices, such as ICs and LSIs, and other microelectronic devices at a lower cost and with fewer irregularities.

极速赛车开奖最快

  • Bumps can be formed with a minimum variance in neck height
  • Bumps can be formed with a minimum variance in shape
  • Suitable for small-volume production

极速赛车开奖官方网站

极速赛车三码计划

极速赛车在线计划

  • In the high temperature storage test (200°C), the shear strength after bump formation, decreases less than other bumping wires (GBC)

极速赛车开奖网

极速赛车免费精准计划

极速赛车在线计划

  • Chips are not damaged during bump formation
Neck Height

Neck Height

Bump Shape

Bump Shape

极速赛车平台登录

Contact us for further information or materials (24 hours a day)
快乐飞艇公式 极速赛车软件 澳洲10开奖直播 澳洲5注册