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Various bonding and sealing materials for precision parts, including evaporation materials for semiconductor devices are available.

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  • Gold and gold alloys are available in wire, ribbon, pellet, block, and ball forms.
  • Reduced trapped air and oxidized additives
Typical Compositions and Shapes
Item Shape
Wire Ribbon Pellet Block Ball
Au (99.99% , 99.999% )
AuSb1.0
AuZn5.0
AuSi3.15
AuBe1.0
AuGe12.5
AuSn20

Compositions other than listed those above are available
Composition range in between AuSn18 to AuSn30 is capable

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Die bonding, wafer evaporation, bonding, sealing, etc.

Gold alloy series

Gold alloy series

Au-Ge ball

Au-Ge ball

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  • Newly developed high-quality Au deposition material
  • Reduces the amount of non-metallic inclusions in a product
  • Given of extremely low level of non-metallic inclusions, contaminants that collect on the surface during melting of the deposition material are reduced, eliminating the need for cleaning.


SJeva (granules)

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